About the product
One machine solution, combining high speed chip shooting and flip chip bonding
Up to 21,000 cph (IPC) flip chip bonding speeds
Up to 121,000 cph (IPC) chipshooting speeds
High quality pick and placement process
no impact force during pick of known good dies or passive components
real-time closed loop placement force feedback on every placed component
down to 10 micron placement accuracy
> 98% first pass yield (at 2000 components per panel)
Up to 21,000 cph (IPC) flip chip bonding speeds
Up to 121,000 cph (IPC) chipshooting speeds
High quality pick and placement process
no impact force during pick of known good dies or passive components
real-time closed loop placement force feedback on every placed component
down to 10 micron placement accuracy
> 98% first pass yield (at 2000 components per panel)
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